SMT Assembly - Shenzhen Tianweisheng Electronic Co., Ltd

SMT Assembly Capabilities

Assembly Types	Surface Mount(SMT) · Through-hole(THT) · Single sided placement
Order Volume	≤50 pcs(Single or panelized PCB)
PCB Size	2 Layer: 10x10mm – 480x320mm 4&6 Layer: 10x10mm – 350x320mm
PCB Panel Size	10x10mm – 250x250mm
PCB Specs for Assembly	2&4&6 layer Green/Black/Blue/Red/White solder mask 0.4/0.6/0.8/1.0/1.2/1.6mm board thickness HASL- Leaded/Lead free / ENIG 1oz copper weight
Components	689 Basic components and 230k+ Extended components(We provide component procurement services)
SMT-Stencil	Laser cut stainless steel (Not delivered with the assembled boards)
Soldering Method	Leadfree

TIANWEISHENG PROCESSING ADVANTAGES

Production equipment “international standard”

With advanced production equipment and testing equipment, the BGA mounting range is 0.18MM-0.4MM. The smallest mounting material package is 01005. Fully automatic SMT production line, with a daily production capacity of 3 million points and top quality control testing equipment, after 9 passes The “testing process” is strictly controlled, high-standard anti-static, 5000 square meters dust-free production workshop

Inquiry Now

ATTENTION TO DETAIL HAS BECOME A HABIT

Material inspection

The quality of the materials determines the service life of the PCB board. All materials of TIANWEISHENG can be used in the factory after strict inspection

Solder paste printing inspection

Three-dimensional detection of the height, area, volume, displacement and other aspects of the tin point to avoid problems such as less tin, more tin, missing printing, etc., to ensure the accuracy of solder paste printing

IPQC check materials

Refer to the engineering drawings and BOM to measure and inspect each material of the first board to ensure that the components attached to the production model are consistent with the engineering drawings and BOM

SMT FAL Instrument

Refer to the Bom and gerber data to measure and inspect each material of the first board to ensure that the components attached to the production model are in full compliance with the customer’s requirements, and prevent bad products from flowing into the next process.

DIP insertion process inspection

Before the DIP insertion, the insertion with direction or pin special components will be trained and explained, and during the plug-in process, the quality inspector will be arranged for continuous inspection to ensure the quality of the insertion

QA shipment inspection

Perform random inspections on all production processes in accordance with the product process instructions and the job instructions to ensure that they are packaged and shipped after they are qualified.

TIANWEISHENG PROCESSING PROCESS

Only very small volume PCBA projects will be handled manually and undergo visual inspection, while majority of the larger projects are processed through reliable automated machinery. All soldering during the PCB assembly process is up to Class 1 standard, while Class 2 and Class 3 standard are also available for you to choose from.TIANWEISHENG will use automated machinery to solder components on your PCB as fast as possible, making use of your pick & place CAD data. Component positions, orientation and solder quality will normally be verified using Automatic Optical Inspection. AOI technology has proven to be extremely reliable whilst looking for errors in PCBs.