PCB Manufacturing Capability:

Article

Description

Capability

Sercive

PCB and SMT assembly with one-stop service

Material

Laminate materials

FR4, high TG FR4, high frequency, alum, FPC

Board cutting

Number of layers

1-48

Min.thickness for inner layers

(Cu thickness are excluded)

0.003”(0.07mm)

Board thickness

Standard

(0.1-4mm±10%)

Min.

Single/Double:0.008±0.004”

4layer:0.01±0.008”

8layer:0.01±0.008”

Bow and twist

no more than 7/1000

Copper weight

Outer Cu weight

0.5-4    0z

Inner Cu weight

0.5-3   0z

Drilling

Min size

0.0078”(0.2mm)

Drill deviation

±0.002″(0.05mm)

PTH  hole  tolerance

±0.002″(0.005mm)

NPTH  hole  tolerance

±0.002″(0.005mm)

Solder mask

 

Color

Green,white,black,red,blue…

Min solder mask clearanace

0.003″(0.07mm)

Thickness

(0.012*0.017mm)

Silkscreen

Color

white,black,yellow,blue…

Min size

0.006″(0.15mm)

E-test

Function Test

100% Functional test

PCBA Testing

X-ray,AOI Test,Functional test

Pcb assembly

one-stop service electronic manufacxturer service

Component sourcing

Yes

Certificate

IATF16949, ISO13485, ISO9001

Delivery time:

PCB

3-8days

PCBA

10-20days

Tolerance of pcb

±5%

Max size of finish board

700*460mm

MOQ

NO MOQ (1pcs)

Surface Finish

HASL,ENIG,immersion silver,immersion tin,OSP…

PCB outline

Square,circle,irregular(with jigs)

package

QFN,BGA,SSOP,PLCC,LGA

Sub-assembly

Plastic,metal,screen

PCB MANUFACTURING PROCESSES

Customer data pre review

-step 1-
Customer data   pre-review

Quote

-Step 2-
Sales quotation

Engineering data production

-Step 3-
Engineering data production

Cutting drilling

-Step 4-
Cutting, drilling

Graphics transfer

-Step 5-
Graphics transfer

Electroplating etching

-Step 6-
Electroplating, etching

Solder mask text

-Step 7-
Solder mask, text

Surface treatment process

-Step 8-
Surface treatment process

forming

-Step 9-
Forming

Inspection

-Step 10-
Inspection

Shipment

-Step 11-
Shipment

service

-Step 12-
Service